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AMAOE MI8 0.12mm MSM8996 CPU BGA Reballing Stencil for Xiaomi Mi 5/5S/5S Plus/Note 2/Mi MIX
βΉ179.00
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Product Description
AMAOE MI8 is a 0.12mm CPU BGA reballing stencil designed for Qualcomm MSM8996 processor reballing. It is compatible with Xiaomi Mi 5, Mi 5S, Mi 5S Plus, Mi Note 2 and Mi MIX, making it suitable for CPU IC reballing and motherboard repair work.
- Model: MI8
- Thickness: 0.12mm
- CPU: Qualcomm MSM8996
- Compatible Devices: Xiaomi Mi 5, Mi 5S, Mi 5S Plus, Mi Note 2, Mi MIX
- Application: CPU BGA Reballing and Motherboard Repair
- Package: 1 Γ Stencil
π Shipping & Delivery Information
UToolsZone Fast & Reliable DeliveryWhen you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

π¦ Estimated Delivery Time
Total delivery time = Processing Time + Shipping Timeπ¦ Processing Time
Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.βοΈ Shipping Time
Shipping time refers to the duration your package takes to travel from our warehouse to your address.π Important Note
Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.Thank you for shopping with UToolsZone β€οΈ
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