The AMAOE EMMC-2 0.15mm BGA Reballing Stencil is designed for eMMC, eMCP and UFS memory IC reballing applications. It is suitable for chip-level repair work where accurate solder ball placement is required. Brand AMAOE Model EMMC-2 Compatibility eMMC / eMCP / UFS Memory IC Thickness 0.15mm Type Memory IC BGA Reballing Stencil Package 1 × Stencil

The AMAOE EMMC-3 0.15mm Multi-IC BGA Reballing Stencil is designed for reballing a wide range of memory IC packages used in mobile and electronic repair. It supports eMMC, eMCP, UFS, uMCP, LPDDR, NAND and PCIe memory IC applications with multiple BGA layouts. Brand AMAOE Model EMMC-3 Application eMMC / eMCP / UFS / uMCP / LPDDR / NAND / PCIe Memory IC Reballing Supported BGA BGA60, BGA70, BGA110, BGA153, BGA162, BGA169, BGA178, BGA186, BGA200, BGA221, BGA254, BGA297 & BGA315 Thickness 0.15mm Type Multi-IC BGA Reballing Stencil Package 1 × Stencil

The AMAOE EU-2 0.12mm BGA Reballing Stencil is designed for Samsung Exynos CPU reballing applications. It supports multiple Exynos chipset models and is suitable for chip-level BGA reballing and repair work. Brand AMAOE Model EU-2 Compatibility Exynos 7880, 8895A, 8895B, 9810, 7580, 7570, 3470, 3475 & 9180 Thickness 0.12mm Material Japanese Steel Sheet Type Exynos CPU BGA Reballing Stencil

The AMAOE EU-3 0.12mm CPU BGA Reballing Stencil is designed for Samsung Exynos processor and RAM reballing during mobile motherboard repair. It supports multiple Exynos IC layouts, making it suitable for technicians working on compatible Samsung devices. Key Features Brand: AMAOE Model: EU-3 Thickness: 0.12mm Material: Japanese steel sheet Type: CPU and RAM BGA reballing stencil Supported ICs: Exynos 7885 CPU/RAM, Exynos 9820, Exynos 9610 CPU/RAM, Exynos 990 CPU/RAM and Exynos 980 Application: IC reballing and Samsung motherboard repair The stencil helps align solder balls or solder paste with the matching BGA pad pattern during IC rework. Compatibility Note: Verify the IC model and stencil layout before use to ensure the correct pattern is selected.

The AMAOE EU-4 0.12mm Exynos IC BGA Reballing Stencil is designed for BGA reballing and motherboard repair on compatible Samsung devices using the matching Exynos IC layout. Key Features Brand: AMAOE Model: EU-4 Thickness: 0.12mm Type: Exynos IC BGA reballing stencil Compatible Brand: Samsung Application: IC reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA pad layout during chip rework. Compatibility Note: Confirm the IC marking and stencil pattern before use to ensure compatibility with the Samsung motherboard being repaired.

The AMAOE EU-5 0.12mm Exynos CPU & RAM BGA Reballing Stencil is designed for reballing compatible Samsung Exynos processors and RAM ICs. It supports Exynos 1080, Exynos 2100, Exynos 9815, Exynos 9609, Exynos 1080 RAM, Exynos 2100 RAM, Samsung 3830 XGO and Exynos 8895-1703. Brand AMAOE Model EU-5 Compatible ICs Exynos 1080, Exynos 2100, Exynos 9815, Exynos 9609, Exynos 1080 RAM, Exynos 2100 RAM, Samsung 3830 XGO & Exynos 8895-1703 Thickness 0.12mm Type CPU & RAM BGA Reballing Stencil Package 1 × Stencil

AMAOE Exynos 1380-E8835P 0.12mm CPU BGA Reballing Stencil The AMAOE Exynos 1380-E8835P is a 0.12mm CPU BGA reballing stencil designed for the Samsung Exynos 1380 processor. It is used for CPU reballing and chip-level motherboard repair work. The stencil provides the required aperture pattern for the E8835P CPU, helping with accurate solder ball placement during the BGA reballing process. Product Details Brand AMAOE Model Exynos1380-E8835P Compatible CPU Samsung Exynos 1380 (E8835P) Type CPU BGA Reballing Stencil Thickness 0.12mm Package 1 × Stencil

AMAOE F-IPLCD is a screen IC refinishing and reballing stencil designed for compatible iPhone display IC repair work. It is used with curing ink and the green oil network film to align the required pad pattern before UV curing. The stencil supports screen IC repair applications for iPhone 12, 12 Pro, 12 Pro Max, 13, 13 Pro, 13 Pro Max, 14, 14 Plus, 14 Pro, 14 Pro Max, 15, 15 Plus and 15 Pro Max models. Brand AMAOE Model F-IPLCD Application Screen IC Refinishing & Reballing Compatible Models iPhone 12–15 Pro Max Series Type Green Oil Network Film Reballing Stencil Package 1 × Stencil Usage: Apply curing ink to the required pad area, place the green oil network film for alignment, and cure it using a UV lamp according to the repair process.

AMAOE F936U-012 is a 0.12mm middle layer BGA reballing stencil designed for Samsung Galaxy Z Fold4 repair work. It is made from Japanese steel sheet with a precise square-hole aperture design for accurate solder ball or solder paste application during BGA reballing. Brand AMAOE Model F936U-012 Thickness 0.12mm Application Middle Layer BGA Reballing Compatibility Samsung Galaxy Z Fold4 SM-F936U-SU / W Material Japanese Steel Sheet Hole Type Square Reusable Yes The model-specific aperture pattern helps align the stencil with the required BGA area for controlled and consistent reballing work.

AMAOE G977-010 is a 0.10mm middle-layer BGA reballing stencil designed for the Samsung Galaxy S10 5G G977 series motherboard. It is used to recreate the solder points on the intermediate layer of the layered motherboard during board separation, repair and reassembly. Model: G977-010 Thickness: 0.10mm Compatible Device: Samsung Galaxy S10 5G Compatible Board Series: G977 Compatible Variants: G977U / G977R / G977T / G977P Product Type: Middle Layer BGA Reballing Stencil Application: Motherboard middle-layer solder point rework and reassembly Size: 70 × 70mm Package: 1 × Stencil This stencil is for the middle-layer motherboard soldering process and is not a CPU or individual IC reballing stencil.

AMAOE G991-012 is a 0.12mm middle layer BGA reballing stencil designed for Samsung Galaxy S21 motherboard repair and reballing work. Its model-specific aperture pattern is designed for the middle-layer reballing application. Brand AMAOE Model G991-012 Thickness 0.12mm Application Middle Layer BGA Reballing Compatibility Samsung S21 SM-G991U / 0 / W / D-S Material Japanese Steel Sheet Hole Type Square Reusable Yes Package 1 × Stencil The stencil provides a precise aperture pattern for controlled solder application during BGA reballing and is designed for repeated professional repair use.

AMAOE G996U-012 is a 0.12mm middle layer BGA reballing stencil designed for Samsung Galaxy S21+ motherboard repair. It features a square aperture pattern for the middle-layer reballing process and is made from stainless steel for repeated use. Brand AMAOE Model G996U-012 Thickness 0.12mm Application Middle Layer BGA Reballing Compatibility Samsung Galaxy S21+ — SM-G996U / SM-G996O / SM-G996D / SM-G996W Material Stainless Steel Pattern Square Reusable Yes Package 1 × Stencil The model-specific aperture pattern helps position solder accurately during middle-layer BGA reballing and motherboard repair work.

AMAOE G998U-012 is a 0.12mm middle layer BGA reballing stencil designed for Samsung Galaxy S21 Ultra motherboard repair and middle-layer reballing work. Its model-specific aperture pattern is used for precise solder application during the reballing process. Brand AMAOE Model G998U-012 Thickness 0.12mm Application Middle Layer BGA Reballing Compatibility Samsung Galaxy S21 Ultra — SM-G998U / SM-G998W / SM-G9980 / SM-G998D / SM-G998E Hole Type Square Reusable Yes Package 1 × Stencil The stencil is designed to align with the corresponding middle-layer BGA pattern, helping technicians apply solder accurately during Samsung Galaxy S21 Ultra motherboard repair.

AMAOE IP11-012 is a 0.12mm middle layer BGA reballing stencil designed specifically for iPhone 11 motherboard repair. It is used for precise solder application during middle-layer reballing work. The stencil is made from Japanese steel sheet with a hard, reusable construction and square apertures designed to match the required motherboard pad pattern. Brand AMAOE Model IP11-012 Thickness 0.12mm Application iPhone 11 Middle Layer BGA Reballing Material Japanese Steel Sheet Hole Type Square Reusable Yes Package 1 × Stencil It helps technicians apply solder paste or position solder balls accurately on the middle-layer motherboard pads during iPhone 11 reballing and repair work.

AMAOE LPDDR-1 is a 0.15mm BGA reballing stencil designed for LPDDR and compatible memory IC reballing work. It provides accurately cut apertures for controlled solder paste or solder ball application during IC rework. The stencil supports multiple BGA package layouts, including BGA60, BGA134, BGA136, BGA168, BGA178 and BGA200, making it suitable for different LPDDR and memory IC repair applications. Brand AMAOE Model LPDDR-1 Thickness 0.15mm Type LPDDR Memory BGA Reballing Stencil Supported BGA BGA60, BGA134, BGA136, BGA168, BGA178 & BGA200 Package 1 × Stencil

AMAOE MI10 is a 0.12mm BGA reballing stencil designed for CPU, RAM and compatible BGA IC reballing on Xiaomi and Redmi smartphone motherboards. It is associated with the Qualcomm SM7150 and SM8150 platforms and is suitable for precision solder-ball placement during IC repair. The stencil is suitable for applications involving Redmi K20, Redmi K20 Pro and Xiaomi Mi 9, with compatibility based on the corresponding SM7150/SM8150 chipset and IC pattern. It can also be used for compatible Qualcomm platform ICs such as PM7150 and PM8150 series components, depending on the stencil pattern. Brand AMAOE Model MI10 / MI-10 Stencil Thickness 0.12mm Type BGA Reballing Stencil Platform Qualcomm SM7150 / SM8150 Compatible Devices Redmi K20, Redmi K20 Pro, Xiaomi Mi 9 Applications CPU, RAM & BGA IC Reballing Package 1 × AMAOE MI10 BGA Stencil The 0.12mm stencil provides the required pad pattern for reballing work and is intended for professional mobile motherboard and micro-soldering applications.

AMAOE MI11 is a 0.12mm BGA reballing stencil designed for CPU, RAM and other BGA IC reballing work on Xiaomi and Redmi motherboards. It provides the required solder-ball pattern for precise IC reballing and motherboard repair. The MI11 stencil supports multiple IC patterns including SM6125, SDM710, MT6785V and other compatible components. It is associated with Xiaomi CC9, CC9e, Mi 8 SE, Mi A3 and Redmi Note 8 series devices. Compatibility should be matched according to the IC or processor code before use. Brand AMAOE Model MI11 / MI-11 Thickness 0.12mm Type BGA Reballing Stencil IC / CPU Support SM6125, SDM710, MT6785V and compatible IC patterns Compatible Devices Xiaomi CC9, CC9e, Mi 8 SE, Mi A3, Redmi Note 8 and compatible models Application CPU, RAM & BGA IC Reballing Package 1 × Stencil The 0.12mm stencil is intended for professional mobile motherboard repair, IC reballing and microsoldering applications.

AMAOE MI12 is a 0.12mm BGA reballing stencil designed for Snapdragon 865 (SM8250) CPU reballing and motherboard repair. It is suitable for compatible Xiaomi and Redmi devices, including Xiaomi Mi 10, Mi 10 Pro and Redmi K30 Pro. The stencil provides a precise solder-ball pattern for reballing compatible CPU chips during mobile motherboard repair. Its 0.12mm thickness is intended for professional BGA rework and microsoldering applications. Brand AMAOE Model MI12 Thickness 0.12mm Type CPU BGA Reballing Stencil CPU Qualcomm Snapdragon 865 (SM8250) Compatible Devices Xiaomi Mi 10, Xiaomi Mi 10 Pro, Redmi K30 Pro Application CPU BGA Reballing and Mobile Motherboard Repair Package 1 × Stencil

AMAOE MI13 is a 0.12mm multi-IC BGA reballing stencil designed for compatible CPU and IC reballing applications. It supports MediaTek MT6769V and Qualcomm SM6115 / SM7225 platforms and is used for motherboard repair and BGA IC reballing. Model: MI13 Thickness: 0.12mm Main CPU Platforms: MT6769V / SM6115 / SM7225 Chipsets: MediaTek MT6769V, Snapdragon 662, Snapdragon 750G BGA Pattern: BGA254 Compatible Devices: Redmi 9, Redmi Note 9, Redmi Note 9 4G, Redmi Note 9 Pro 5G and other compatible devices using the supported CPU platforms Application: CPU and BGA IC Reballing Material: Japanese Steel Sheet Hole Type: Square Reusable: Yes Package: 1 × Stencil

AMAOE MI14 is a 0.12mm BGA reballing stencil designed for Qualcomm SM8350 / Snapdragon 888 CPU and RAM reballing. It is compatible with Xiaomi Mi 11 series and Redmi K40 Pro and includes multiple BGA patterns for CPU, RAM and supporting IC reballing. Model: MI14 Thickness: 0.12mm Main CPU: Qualcomm SM8350 / Snapdragon 888 CPU Pattern: SM8350 CPU RAM Pattern: SM8350 RAM BGA Pattern: BGA153 Supporting IC Patterns: PM8350BH-001, PM8350/C, QMP5679, SMB1396, WCD9380, WCN6851 Compatible Devices: Xiaomi Mi 11, Mi 11 Pro, Mi 11 Ultra, Mi 11i, Mi 11X Pro, Redmi K40 Pro Application: CPU, RAM and BGA IC Reballing Package: 1 × Stencil

AMAOE MI15 is a 0.12mm BGA reballing stencil designed for CPU reballing and mobile motherboard repair. It is intended for compatible Qualcomm processors used in selected Xiaomi and Redmi smartphones. This stencil is listed for Xiaomi 12, Xiaomi 12 Pro, Xiaomi 12X and Redmi K50 eSports Edition. It supports the specified Qualcomm SM8450 and SM8250 BGA patterns. Check the processor marking and stencil pattern before use to ensure compatibility. Brand AMAOE Model MI15 Thickness 0.12mm Type CPU BGA Reballing Stencil Supported Chipsets Qualcomm SM8450 / SM8250 Compatible Devices Xiaomi 12, Xiaomi 12 Pro, Xiaomi 12X, Redmi K50 eSports Edition Application CPU BGA Reballing and Mobile Motherboard Repair Package 1 × Stencil The stencil is intended for professional BGA rework, CPU reballing and microsoldering applications. It helps position solder balls in the required pattern during IC reballing.

AMAOE MI16 is a 0.12mm CPU BGA reballing stencil designed for MediaTek Dimensity 8100 and Dimensity 9000 processor platforms. It supports MT6895Z and MT6983Z CPU layouts and is suitable for CPU, RAM and supporting IC reballing during Xiaomi and Redmi motherboard repair. Model: MI16 Thickness: 0.12mm CPU Platforms: MediaTek Dimensity 8100 / Dimensity 9000 Chip Codes: MT6895Z / MT6983Z Compatible Devices: Redmi K50, Redmi K50 Pro, Redmi Note 11 Pro, Redmi Note 11 Pro+, Xiaomi 12 Pro Dimensity Edition Supported Patterns: CPU, RAM, BGA153 and multiple supporting IC layouts Application: CPU, RAM and BGA IC Reballing Package: 1 × Stencil The stencil is designed to match the BGA pad layout of the supported processor and memory packages for accurate solder-ball placement during reballing work.

AMAOE MI17 is a 0.12mm CPU BGA reballing stencil designed for mobile motherboard repair. It is intended for reballing compatible MediaTek Dimensity processors used in selected Redmi smartphones. The stencil is listed for Redmi Note 12 Pro and Redmi Note 12 Pro+ models with supported Dimensity 810, Dimensity 1100 and Dimensity 1200 CPU patterns. Before use, check the processor model and stencil pattern to ensure compatibility. Brand AMAOE Model MI17 Thickness 0.12mm Type CPU BGA Reballing Stencil Supported Processors MediaTek Dimensity 810 / 1100 / 1200 Compatible Devices Redmi Note 12 Pro / Redmi Note 12 Pro+ Application CPU Reballing and Mobile Motherboard Repair Package 1 × Stencil The 0.12mm stencil provides the required solder-ball layout for compatible CPU reballing work. It is intended for professional BGA rework and microsoldering applications.

AMAOE MI18 is a 0.12mm CPU BGA reballing stencil designed for the JLQ JR510 processor used in the POCO C40. It is part of the Universal Series and is intended for professional mobile motherboard IC reballing and repair. The MI18 is designed around the JR510 CPU pattern and can also be used for compatible IC reballing patterns provided on the stencil. It is suitable for POCO C40 motherboard repair and BGA reballing work. Brand AMAOE Model MI18 / MI-18 Thickness 0.12mm Type CPU Universal Series BGA Reballing Stencil CPU JLQ JR510 Compatible Device POCO C40 Application CPU & BGA IC Reballing, Mobile Motherboard Repair Package 1 × Stencil The 0.12mm stencil provides the required aperture pattern for controlled solder-ball placement during CPU and IC reballing. Check the IC marking and stencil pattern before use to ensure compatibility.

AMAOE MI19 is a 0.12mm BGA reballing stencil designed for Qualcomm Snapdragon 8 Gen 2 / SM8550 CPU reballing. It is suitable for Xiaomi 13 Series motherboard repair and CPU BGA reballing applications. Model: MI19 Thickness: 0.12mm CPU: Snapdragon 8 Gen 2 / SM8550 Compatible Series: Xiaomi 13 Series Application: CPU BGA Reballing Package: 1 × Stencil

AMAOE MI6 is a 0.12mm BGA reballing stencil designed for Qualcomm Snapdragon 636 and Snapdragon 660 IC reballing. It is suitable for motherboard repair and BGA reballing applications on compatible Xiaomi and Redmi devices. Model: MI6 Thickness: 0.12mm Compatible CPUs: Qualcomm Snapdragon 636 / Snapdragon 660 Compatible Devices: Xiaomi Mi Note 3, Xiaomi Mi 6X, Redmi Note 5, Redmi Note 5 Pro Application: BGA IC Reballing Package: 1 × Stencil

AMAOE MI7 is a 0.12mm CPU BGA reballing stencil designed for Qualcomm MSM8953 and MSM8917 processors. MSM8953 corresponds to Snapdragon 625, while MSM8917 corresponds to Snapdragon 425. The stencil is suitable for CPU reballing and motherboard repair on compatible Xiaomi and Redmi devices. Specifications: Model: MI7 Thickness: 0.12mm Compatible CPU: Qualcomm MSM8953 / MSM8917 Chipsets: Snapdragon 625 / Snapdragon 425 Compatible Devices: Redmi Note 4X, Redmi 4, Redmi 4A, Redmi 5A, Redmi 5 Plus, Redmi S2, Xiaomi Mi 5X and Mi Max 2 Application: CPU BGA Reballing and Motherboard Repair Package: 1 × Stencil For best compatibility, match the processor code on the motherboard with MSM8953 or MSM8917 before using the stencil.

AMAOE MI8 is a 0.12mm CPU BGA reballing stencil designed for Qualcomm MSM8996 processor reballing. It is compatible with Xiaomi Mi 5, Mi 5S, Mi 5S Plus, Mi Note 2 and Mi MIX, making it suitable for CPU IC reballing and motherboard repair work. Model: MI8 Thickness: 0.12mm CPU: Qualcomm MSM8996 Compatible Devices: Xiaomi Mi 5, Mi 5S, Mi 5S Plus, Mi Note 2, Mi MIX Application: CPU BGA Reballing and Motherboard Repair Package: 1 × Stencil

AMAOE MI9 is a 0.12mm CPU BGA reballing stencil designed for Qualcomm Snapdragon 845 (SDM845) and Snapdragon 710 (SDM710) processor reballing. It is compatible with Xiaomi Mi 8, Mi 8 SE and Mi MIX 2S for motherboard repair and CPU BGA reballing applications. Model: MI9 Thickness: 0.12mm Compatible CPUs: Qualcomm Snapdragon 845 / Snapdragon 710 CPU Codes: SDM845 / SDM710 Compatible Devices: Xiaomi Mi 8, Mi 8 SE, Mi MIX 2S Application: CPU BGA Reballing and Motherboard Repair Package: 1 × Stencil

The AMAOE Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer repair and solder-pad rework on compatible Samsung Galaxy Z Flip devices. Check your device model carefully before selecting this stencil. Product Details Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Compatible Models: Samsung SM-F700F / SM-F700U Application: Motherboard middle-layer soldering and rework Important: Confirm that your phone's model number is SM-F700F or SM-F700U before ordering. This listing is for a middle-layer stencil; it is not a complete repair service or motherboard.