AMAOE U-QSD6 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

AMAOE U-QSD6 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

β‚Ή199.00
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Model: U-QSD6
Availability: In Stock
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Product Description

AMAOE U-QSD6 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

The AMAOE U-QSD6 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon motherboard repair. It supports selected CPU, RAM and related IC layouts for chip-level mobile phone servicing.

Supported IC Models

  • CPU: SM8150, SM7150, SDM845
  • RAM: RAM556
  • Power ICs: PM8150, PM8150A, PM8150B, PM7150, PM7150A, PM845, PMI8998
  • Other ICs: DA9313, SMB1390, WCN3990, WCD9340, SDR8150, SDR660, QM57016, BGA153, BGA254

Specifications: Model U-QSD6, 0.12 mm thickness.

Note: Confirm the IC marking and matching stencil pattern before use.

🚚 Shipping & Delivery Information

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When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.
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🌍 Important Note

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