AMAOE U-QSD2 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

Name: AMAOE U-QSD2 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil
Brand: AMAOE
SKU: U-QSD2
Availability: InStock

₹199.00

Brand: AMAOE

Model: U-QSD2

Availability: In Stock

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Tags: CPU Reballing RAM Repair BGA Stencil

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Product Description

AMAOE U-QSD2 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

The AMAOE U-QSD2 is a multi-pattern BGA reballing stencil for mobile motherboard repair. It is designed for selected Qualcomm Snapdragon CPUs, RAM chips and BGA153 ICs, helping technicians restore solder ball patterns during chip-level repairs.

Supported IC Models

CPU: MSM8998 (Snapdragon 835), MSM8996 (Snapdragon 820/821)
RAM: MSM8998 RAM, MSM8996 RAM
Other pattern: BGA153

Specifications: Model U-QSD2, 0.12 mm thickness, reusable steel stencil.

Note: Check the IC marking and matching stencil pattern before use.

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🚚 Shipping & Delivery Information

UToolsZone Fast & Reliable Delivery

When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.

📦 Estimated Delivery Time

Total delivery time = Processing Time + Shipping Time

📦 Processing Time

Time required to prepare your order including order verification, quality check, and secure packaging before dispatch.

✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.