AMAOE U-QSD5 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

AMAOE U-QSD5 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

β‚Ή199.00
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Model: U-QSD5
Availability: In Stock
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Product Description

AMAOE U-QSD5 Qualcomm Snapdragon CPU & RAM BGA Reballing Stencil

The AMAOE U-QSD5 is a multi-pattern BGA reballing stencil designed for Qualcomm Snapdragon CPU and RAM chip repair. It helps mobile repair technicians restore solder ball patterns during motherboard-level servicing.

Supported IC Models

  • CPU: SM6125, SM6150, SDM636, SDM660, SDM670, SDM710
  • Other ICs: WCN3980, WCN3990, WCD9370, DA9313, PM670A, PM670, SDR660, PM6150, PM6150L, PMI632, BGA254, 56020, 7210M-11, PM1632, 77920-21

Specifications: Model U-QSD5, 0.12 mm thickness, stainless steel stencil with square-pattern openings.

Note: Confirm the IC marking and stencil pattern before use.

🚚 Shipping & Delivery Information

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When you place an order on UToolsZone, you will receive an order confirmation email instantly. Once your order is shipped, we will send you a tracking number so you can track your package easily. During checkout, you can choose your preferred shipping method based on your location and delivery speed.
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πŸ“¦ Processing Time

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✈️ Shipping Time

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🌍 Important Note

Delivery time may vary based on location, courier service, and external delays like customs or weather conditions. For any issue, contact our support team anytime.

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