2UUL BH17 CPU Reball Base Magnetic Dual Sided BGA Reballing Platform Set for iPhone / Android Key Specifications & Components Model: BH17 (Cpureball Base). Structure: CNC-machined aluminum alloy body with a dual-sided magnetic frame for maximum stability. Included Stencils: Typically comes with 75 precision CPU stencils covering a wide range of chipsets. Stencil Thickness: Includes options for 0.12mm (some kits specify T0.6 for Apple and T0.35 for Android) to handle various reballing requirements. Dimensions: Platform size is approximately 58 × 58 × 11 mm with a net weight of 238g.  Features and Benefits Magnetic Locking: Features a powerful dual-sided magnetic system that holds both the CPU and the stencil firmly in place, preventing shifting during heating. High Compatibility: Supports a broad spectrum of mobile processors, including Apple A-series (A10 to A19), Qualcomm Snapdragon (up to SM8750/Snapdragon 8 Ultra), MediaTek (MTK), and Samsung Exynos. Efficiency: The dual-sided design allows technicians to switch between different chip types quickly without losing alignment, increasing workflow throughput. Thermal Contact: Engineered for improved thermal contact and heat resistance, ensuring the platform does not warp or lose magnetic strength during hot-air reflow.  Usage Tips Preparation: Always place the platform on a flat, stable work surface. Alignment: Carefully align the CPU and the magnetic stencil before applying heat to ensure even solder ball distribution. Heat Management: Avoid excessive hot air pressure which can cause "stencil lift." Do not overheat the base excessively to preserve the life of the internal magnets. Maintenance: Clean stencils thoroughly after each use with a suitable solvent (like Relife RL-055 dispenser bottle) to maintain aperture accuracy.

AMAOE 0.10mm Magnetic BGA Reballing Stencil for MacBook A1707-T1-343S00136 Model-specific BGA reballing stencil designed for MacBook A1707-T1-343S00136. The AMAOE 0.10mm Magnetic BGA Reballing Stencil is designed specifically for the MacBook A1707-T1-343S00136 and is intended for BGA reballing work during motherboard repair. Product Features Designed for MacBook A1707-T1-343S00136 Suitable for BGA reballing applications 0.10mm stencil thickness Magnetic stencil design Compatibility Compatible Model: MacBook A1707-T1-343S00136 Specifications Brand AMAOE Model A1707-T1-343S00136 Type Magnetic BGA Reballing Stencil Compatible Model MacBook A1707-T1-343S00136 Thickness 0.10mm

AMAOE 0.12mm 339S00912 WiFi BGA Reballing Stencil for Apple MacBook Pro 2021 Model-specific WiFi BGA reballing stencil for Apple MacBook Pro 2021 motherboard repair. The AMAOE 339S00912 WiFi BGA Reballing Stencil is designed for the WiFi module used in Apple MacBook Pro 2021. It is intended for BGA reballing work during motherboard and WiFi module repair. Product Features 339S00912 WiFi Stencil – Designed for the 339S00912 WiFi module. MacBook Pro 2021 Compatible – Intended for the corresponding WiFi module application in Apple MacBook Pro 2021. 0.12mm Thickness – Product thickness specified for this stencil. BGA Reballing – Suitable for WiFi module BGA reballing and motherboard repair work. Compatibility Compatible Device: Apple MacBook Pro 2021 WiFi Module: 339S00912 Specifications Brand AMAOE Model 339S00912 Type WiFi BGA Reballing Stencil Compatible Device Apple MacBook Pro 2021 Thickness 0.12mm Package Includes 1 × AMAOE 339S00912 WiFi BGA Reballing Stencil

AMAOE 0.12mm BGA Reballing Stencil for A1707 Hard Disk Master IC The AMAOE A1707 is a 0.12mm BGA reballing stencil designed for A1707 Hard Disk Master IC repair work. It is available in two different stencil options: CPU and RAM. Choose the required Stencil Type — CPU or RAM — according to the IC you need to reball. Each option is a dedicated stencil pattern for its respective IC. Available Stencil Types ``` CPU: A1707 CPU BGA reballing stencil RAM: A1707 RAM BGA reballing stencil Product Details ``` Brand AMAOE Model A1707 Stencil Type CPU / RAM Thickness 0.12mm Application BGA Reballing & IC Repair Select the correct option before ordering: Choose CPU for the CPU stencil or RAM for the RAM stencil.

AMAOE 0.12mm BGA Reballing Stencil for Dimensity 8100 Max MT6895Z Lower Layer Model-specific lower-layer BGA reballing stencil for MediaTek Dimensity 8100 Max MT6895Z. The AMAOE 0.12mm BGA Reballing Stencil is designed for MediaTek Dimensity 8100 Max (MT6895Z) lower-layer reballing applications. It is intended for IC and motherboard repair work where reballing of the corresponding BGA package is required. Product Features MT6895Z Compatible – Designed for the MediaTek Dimensity 8100 Max. Lower Layer Stencil – Intended specifically for lower-layer BGA reballing work. 0.12mm Thickness – Product thickness specified for this stencil. BGA Reballing – Suitable for professional IC and motherboard repair applications. Compatibility Compatible Chip: MediaTek Dimensity 8100 Max (MT6895Z) Application: Lower Layer BGA Reballing Specifications Brand AMAOE Model MT6895Z Compatible Chip Dimensity 8100 Max Type BGA Reballing Stencil Application Lower Layer Thickness 0.12mm Package Includes 1 × AMAOE MT6895Z BGA Reballing Stencil

The AMAOE Middle Layer BGA Reballing Stencil is designed for motherboard middle-layer soldering work on the Samsung Galaxy S20 Ultra G988B/BR. It helps technicians align solder paste or solder balls with the corresponding pad pattern when repairing and reassembling the separated motherboard layers. Product Specifications Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Thickness: 0.12mm Compatible Device: Samsung Galaxy S20 Ultra Model Compatibility: G988B / G988BR Application: Motherboard middle-layer soldering and rework Package Contents: 1 × Middle Layer Stencil Usage: Match the stencil pattern with the motherboard's middle-layer solder pad layout before starting rework. Confirm the board model and pattern compatibility before use.

The AMAOE Middle Layer BGA Reballing Stencil is designed for middle-layer motherboard repair on the Samsung Galaxy S20 Ultra G988U. It helps technicians reproduce the solder-pad pattern when reworking and reassembling separated motherboard layers. Specifications Brand: AMAOE Product Type: Middle Layer BGA Reballing Stencil Compatible Device: Samsung Galaxy S20 Ultra Model: G988U Thickness: 0.12mm Application: Motherboard middle-layer soldering and rework Package Contents: 1 × Stencil Usage: Align the stencil with the matching motherboard pad pattern before reballing. Confirm the board model and stencil pattern before starting repair work.

AMAOE 1+10P 0.12mm Middle Layer BGA Reballing Stencil for OnePlus 10 Pro Model-specific middle layer BGA reballing stencil designed for OnePlus 10 Pro motherboard repair. The AMAOE 1+10P Middle Layer BGA Reballing Stencil is specifically designed for the OnePlus 10 Pro. It is used for middle-layer BGA reballing work during motherboard and IC repair. The stencil has a 0.12mm thickness and a 70 × 70mm size, making it suitable for the corresponding OnePlus 10 Pro middle-layer reballing application. Key Features OnePlus 10 Pro Compatible – Designed specifically for OnePlus 10 Pro motherboard repair. Middle Layer BGA Reballing – Suitable for middle-layer BGA reballing applications. 0.12mm Thickness – Model-specific stencil thickness. 70 × 70mm Size – Size specified for the 1+10P version. AMAOE 1+10P – Model-specific reballing stencil. Compatibility Compatible Model: OnePlus 10 Pro This 1+10P stencil is intended for the OnePlus 10 Pro. Please make sure the model matches your repair requirement before ordering. Specifications Brand AMAOE Model 1+10P Type Middle Layer BGA Reballing Stencil Compatible Model OnePlus 10 Pro Thickness 0.12mm Size 70 × 70mm Package Includes 1 × AMAOE 1+10P Middle Layer BGA Reballing Stencil

AMAOE 1+11 0.12mm Middle Layer BGA Reballing Stencil The AMAOE 1+11 is a 0.12mm middle layer BGA reballing stencil designed for the OnePlus 11. It is used for middle-layer reballing work during motherboard and IC repair. The stencil provides the required hole pattern for solder ball placement on the middle layer, making it suitable for BGA reballing work. Brand AMAOE Model 1+11 Compatible Device OnePlus 11 Thickness 0.12mm Type Middle Layer BGA Reballing Stencil Size 70 × 70mm

AMAOE 1+9 Pro Middle Layer BGA Reballing Stencil The AMAOE 1+9 Pro is a middle-layer BGA reballing stencil designed for motherboard repair on the OnePlus 9 Pro. It is used by mobile repair technicians during solder-ball rework on compatible motherboard middle-layer layouts. Product Features Designed for OnePlus 9 Pro middle-layer motherboard reballing. Helps position solder balls for compatible BGA pad layouts. Suitable for professional mobile phone motherboard repair work. Compatibility OnePlus 9 Pro (1+9 Pro) Note: Confirm the motherboard layout and stencil alignment before use.

AMAOE 26×26mm 0.30mm Universal BGA Reballing Stencil The AMAOE Universal BGA Reballing Stencil measures 26×26mm and has a 0.30mm thickness with 1.27mm spacing. It is designed for universal BGA reballing applications. Brand AMAOE Size 26×26mm Thickness 0.30mm Spacing 1.27mm Type Universal BGA Reballing Stencil

AMAOE 337S00175 0.12mm BGA Reballing Stencil for Notebook CPU & RAM The AMAOE 337S00175 is a 0.12mm BGA reballing stencil designed for notebook board repair. It is available in two dedicated stencil types: CPU and RAM. Select the required Stencil Type before placing your order. Choose CPU for the CPU stencil or RAM for the RAM stencil. Each option has its own dedicated BGA pattern for the respective IC. Available Options CPU: 337S00175 CPU BGA reballing stencil RAM: 337S00175 RAM BGA reballing stencil Product Details Brand AMAOE Model 337S00175 Stencil Type CPU / RAM Thickness 0.12mm Application BGA Reballing & Notebook Board Repair Select the correct Stencil Type before ordering: Choose CPU or RAM according to the IC you need to reball.

AMAOE 339S00883 0.15mm BGA Reballing Stencil The AMAOE 339S00883 is a 0.15mm BGA reballing stencil designed for the Apple M1 CPU. It is suitable for CPU reballing and chip-level motherboard repair work. Brand AMAOE Model M1 CPU Compatible CPU Apple M1 CPU 339S00883 Thickness 0.15mm Type M1 CPU BGA Reballing Stencil Package 1 × Stencil

AMAOE 50×50mm 0.30mm Universal BGA Reballing Stencil The AMAOE Universal BGA Reballing Stencil measures 50×50mm and has a 0.30mm thickness with 1.0mm spacing. It is designed for universal BGA reballing applications. Brand AMAOE Size 50×50mm Thickness 0.30mm Spacing 1.0mm Type Universal BGA Reballing Stencil

AMAOE A17 0.12mm Lower Layer CPU BGA Reballing Stencil The AMAOE A17 is a 0.12mm lower layer CPU BGA reballing stencil designed for the Apple A17 CPU used in the iPhone 15 Pro and iPhone 15 Pro Max. It is used for CPU reballing and chip-level motherboard repair work. The stencil provides the required aperture pattern for the A17 CPU lower layer, helping with accurate solder ball placement during the BGA reballing process. Product Details Brand AMAOE Model A17 Compatible Models iPhone 15 Pro / iPhone 15 Pro Max Chip Apple A17 CPU Type Lower Layer CPU BGA Reballing Stencil Thickness 0.12mm Package 1 × Stencil

AMAOE A17 RAM 0.12mm Upper Layer BGA Reballing Stencil The AMAOE A17 RAM is a 0.12mm upper layer BGA reballing stencil designed for Apple A17 RAM reballing work. It is suitable for chip-level motherboard repair and RAM reballing. The stencil provides the required aperture pattern for solder ball placement on the A17 RAM upper layer during BGA reballing. Brand AMAOE Model A17 RAM Compatible IC Apple A17 RAM Thickness 0.12mm Type Upper Layer BGA Reballing Stencil Package 1 × Stencil

The AMAOE AU-4 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Apple iPhone devices using A13 and A14 processors. Key Features Brand: AMAOE Model: AU-4 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported CPU: Apple A13 and A14 Application: iPhone CPU reballing and motherboard repair Material: Japanese steel sheet, as listed by the seller The stencil helps technicians align solder balls or solder paste with the matching BGA layout during CPU rework. Compatibility Note: Confirm the CPU generation and stencil pattern before use to ensure compatibility with the motherboard being repaired.

The AMAOE AU1 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Apple iPhone devices using A7, A8 and A9 processors. Its stencil pattern supports CPU and RAM reballing work for the corresponding chip layouts. Key Features Brand: AMAOE Model: AU1 Thickness: 0.12mm Type: CPU and RAM BGA reballing stencil Supported Processors: Apple A7, A8 and A9 Compatible Device Brand: Apple iPhone Material: Japanese steel sheet Application: CPU/RAM reballing and iPhone motherboard repair The stencil helps technicians align solder balls or solder paste with the matching BGA layout during chip rework. Compatibility Note: Confirm the processor generation and stencil pattern before use to ensure compatibility with the motherboard being repaired.

The AMAOE AU3 CPU BGA Reballing Stencil is designed for CPU reballing and motherboard repair on compatible Apple iPhone devices using A10, A11 or A12 processors. The AU3 stencil is listed for these Apple CPU generations by AMAOE. Key Features Brand: AMAOE Model: AU3 Type: CPU BGA reballing stencil Supported CPU Generations: Apple A10, A11 and A12 Compatible Device Brand: Apple iPhone Application: CPU reballing and motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA layout during CPU rework. Compatibility Note: Confirm the CPU generation and stencil pattern before use to ensure compatibility with the motherboard being repaired.

AMAOE BGA315 0.12mm Hard Drive NAND BGA Reballing Stencil The AMAOE BGA315 is a 0.12mm Hard Drive NAND BGA reballing stencil designed for iPhone 14 repair work. It is used for accurately placing solder balls on the BGA315 NAND during hard drive reballing and motherboard repair. The stencil provides the required BGA315 pattern for NAND chip reballing, helping technicians maintain accurate solder ball placement during the repair process. Product Details Brand AMAOE Model BGA315 Compatible With iPhone 14 Chip BGA315 NAND / Hard Drive Thickness 0.12mm Application Hard Drive NAND BGA Reballing Suitable for: iPhone 14 BGA315 NAND / Hard Drive reballing and motherboard repair.

AMAOE BGA316 0.15mm BGA Reballing Stencil The AMAOE BGA316 is a 0.15mm BGA reballing stencil designed for precise solder ball placement during chip-level BGA reballing and repair work. Brand AMAOE Model BGA316 Thickness 0.15mm Type BGA Reballing Stencil Package 1 × Stencil

The AMAOE BS:1 0.12mm BGA Reballing Stencil is designed for Qualcomm SM8250 and SM8350 platforms used in Black Shark smartphones. It is suitable for BGA reballing work on compatible Black Shark 3 to 4S Pro models. Brand AMAOE Model BS:1 Compatibility Qualcomm SM8250 / SM8350 – Black Shark 3, 3 Pro, 3S, 4, 4 Pro, 4S & 4S Pro Thickness 0.12mm Type BGA Reballing Stencil Package 1 × Stencil

The AMAOE BS:2 0.12mm BGA Reballing Stencil is designed for Qualcomm SDM845 and SM8150 platforms used in Black Shark smartphones. It is suitable for BGA reballing work on compatible Black Shark 1, 2, 2 Pro and Helo models. Brand AMAOE Model BS:2 Compatibility Qualcomm SDM845 / SM8150 – Black Shark 1, 2, 2 Pro & Helo Thickness 0.12mm Type BGA Reballing Stencil Package 1 × Stencil

The AMAOE CD3215 4-in-1 0.12mm Magnetic BGA Reballing Stencil is designed for MacBook CD3215 IC reballing work. Its 4-in-1 design provides multiple stencil layouts in a single plate, while the magnetic construction helps with positioning during the reballing process. Brand AMAOE Model CD3215 Compatibility MacBook – CD3215 BGA IC Thickness 0.12mm Type 4-in-1 Magnetic BGA Reballing Stencil Package 1 × Stencil

The AMAOE CD3217 4-in-1 0.12mm Magnetic BGA Reballing Stencil is designed for MacBook CD3217 IC reballing work. Its 4-in-1 design provides multiple stencil layouts in one plate, while the magnetic construction helps with positioning during the reballing process. Brand AMAOE Model CD3217 Compatibility MacBook – CD3217 BGA IC Thickness 0.12mm Type 4-in-1 Magnetic BGA Reballing Stencil Package 1 × Stencil

The AMAOE CHG1 0.12mm Charging IC Comprehensive BGA Reballing Stencil is designed for charging IC reballing work. Its 0.12mm stencil thickness is suitable for precise solder ball placement during chip-level repair. Brand AMAOE Model CHG1 Application Charging IC BGA Reballing Thickness 0.12mm Type Comprehensive BGA Reballing Stencil Package 1 × Stencil

AMAOE DDR BGA178 BGA Reballing Stencil The AMAOE DDR BGA178 is a BGA reballing stencil designed for DDR BGA178 IC chip soldering and reballing work. It helps position solder balls during the reballing process. Brand AMAOE Model DDR BGA178 Application DDR BGA178 IC reballing Type BGA Reballing Stencil

AMAOE DDR BGA78 BGA Reballing Stencil The AMAOE DDR BGA78 is a BGA reballing stencil designed for DDR BGA78 IC chip reballing and soldering work. It helps position solder balls during the reballing process. Brand AMAOE Model DDR BGA78 Application DDR BGA78 IC reballing Type BGA Reballing Stencil

AMAOE E8535P 0.12mm CPU BGA Reballing Stencil The AMAOE E8535P is a 0.12mm CPU BGA reballing stencil designed for the Samsung Exynos 1350 processor. It is suitable for CPU reballing and chip-level motherboard repair. The stencil provides the required aperture pattern for E8535P CPU reballing and solder ball placement. Brand AMAOE Model E8535P Compatible CPU Samsung Exynos 1350 (E8535P) Thickness 0.12mm Type CPU BGA Reballing Stencil Package 1 × Stencil