Search

AMAOE E8535P 0.12mm CPU BGA Reballing Stencil The AMAOE E8535P is a 0.12mm CPU BGA reballing stencil designed for the Samsung Exynos 1350 processor. It is suitable for CPU reballing and chip-level motherboard repair. The stencil provides the required aperture pattern for E8535P CPU reballing and solder ball placement. Brand AMAOE Model E8535P Compatible CPU Samsung Exynos 1350 (E8535P) Thickness 0.12mm Type CPU BGA Reballing Stencil Package 1 × Stencil..

The AMAOE EU-2 0.12mm BGA Reballing Stencil is designed for Samsung Exynos CPU reballing applications. It supports multiple Exynos chipset models and is suitable for chip-level BGA reballing and repair work. Brand AMAOE Model EU-2 Compatibility Exynos 7880, 8895A, 8895B, 9810, 7580, 7570, 3470, 3475 & 9180 Thickness 0.12mm Material Japanese Steel Sheet Type Exynos CPU BGA Reballing Stencil..

The AMAOE EU-3 0.12mm CPU BGA Reballing Stencil is designed for Samsung Exynos processor and RAM reballing during mobile motherboard repair. It supports multiple Exynos IC layouts, making it suitable for technicians working on compatible Samsung devices. Key Features Brand: AMAOE Model: EU-3 Thickness: 0.12mm Material: Japanese steel sheet Type: CPU and RAM BGA reballing stencil Supported ICs: Exynos 7885 CPU/RAM, Exynos 9820, Exynos 9610 CPU/RAM, Exynos 990 CPU/RAM and Exynos 980 Application: IC reballing and Samsung motherboard repair The stencil helps align solder balls or solder paste with the matching BGA pad pattern during IC rework. Compatibility Note: Verify the IC model and stencil layout before use to ensure the correct pattern is selected...

The AMAOE EU-4 0.12mm Exynos IC BGA Reballing Stencil is designed for BGA reballing and motherboard repair on compatible Samsung devices using the matching Exynos IC layout. Key Features Brand: AMAOE Model: EU-4 Thickness: 0.12mm Type: Exynos IC BGA reballing stencil Compatible Brand: Samsung Application: IC reballing and mobile motherboard repair The stencil helps technicians align solder balls or solder paste with the corresponding BGA pad layout during chip rework. Compatibility Note: Confirm the IC marking and stencil pattern before use to ensure compatibility with the Samsung motherboard being repaired...

The AMAOE EU-5 0.12mm Exynos CPU & RAM BGA Reballing Stencil is designed for reballing compatible Samsung Exynos processors and RAM ICs. It supports Exynos 1080, Exynos 2100, Exynos 9815, Exynos 9609, Exynos 1080 RAM, Exynos 2100 RAM, Samsung 3830 XGO and Exynos 8895-1703. Brand AMAOE Model EU-5 Compatible ICs Exynos 1080, Exynos 2100, Exynos 9815, Exynos 9609, Exynos 1080 RAM, Exynos 2100 RAM, Samsung 3830 XGO & Exynos 8895-1703 Thickness 0.12mm Type CPU & RAM BGA Reballing Stencil Package 1 × Stencil..

AMAOE Exynos 1380-E8835P 0.12mm CPU BGA Reballing Stencil The AMAOE Exynos 1380-E8835P is a 0.12mm CPU BGA reballing stencil designed for the Samsung Exynos 1380 processor. It is used for CPU reballing and chip-level motherboard repair work. The stencil provides the required aperture pattern for the E8835P CPU, helping with accurate solder ball placement during the BGA reballing process. Product Details Brand AMAOE Model Exynos1380-E8835P Compatible CPU Samsung Exynos 1380 (E8835P) Type CPU BGA Reballing Stencil Thickness 0.12mm Package 1 × Stencil..

The AMAOE SAM16 0.12mm CPU BGA Reballing Stencil is designed for CPU reballing and mobile motherboard repair involving compatible Samsung Exynos 1280 processor layouts. It is intended for technicians carrying out chip-level servicing and BGA rework. Key Features Brand: AMAOE Model: SAM16 Thickness: 0.12mm Type: CPU BGA reballing stencil Supported Processor: Samsung Exynos 1280 / E8825 Application: CPU reballing and smartphone motherboard repair The stencil helps align solder balls or solder paste with the matching BGA pattern during CPU reballing. Check the processor marking and stencil layout before starting the repair. Compatibility Note: Confirm the exact processor and motherboard layout before use, as compatibility may vary by device model and revision...

AMAOE U-SMG1 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG1 is a multi-pattern BGA reballing stencil designed for Samsung Exynos chip repair. It helps technicians restore solder ball patterns on compatible CPUs, RAM and related ICs during mobile motherboard repairs. Supported IC Models CPU: Exynos 8895, Exynos 7570, Exynos 7580, Exynos 3475 Related ICs: MAX778655, QM78038, SHANNON955, BGA221, BGA153, 4015B1, AFEM-9060, VJ51D, 77759-51, 605HP5, CS47L93 RAM: Exynos 8895 RAM Specifications: Model U-SMG1, 0.12 mm thickness. Note: Confirm the chip marking and matching stencil pattern before use...

AMAOE U-SMG2 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG2 is a multi-pattern BGA reballing stencil designed for Samsung Exynos chip repair. It helps technicians restore solder ball patterns on compatible CPUs, RAM and supporting ICs during mobile motherboard repairs. Supported IC Models CPU: Exynos 9610, 9611, 7904, 7885, 7884, 7880, 7870 RAM: Exynos 9610/9611 RAM, Exynos 7884/7885/7904 RAM, Exynos 7870/7880 RAM Power ICs: S2MU004X, S2MU005X03, SM5713, S915, S515, S527S Other ICs: BCM43456HKUBG, SHANNON937, D5328/TFBMA, 77656-11, MU106X01-5, BGA153 Specifications: Model U-SMG2, 0.12 mm thickness, stainless steel stencil. Note: Check the IC marking and matching stencil pattern before use...

AMAOE U-SMG3 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG3 is a multi-pattern BGA reballing stencil designed for Samsung Exynos motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs and RAM during chip-level mobile phone repairs. Supported IC Models CPU: Exynos 9810, Exynos 9820, Exynos 850, Exynos 3830 RAM: RAM556 Application: CPU and RAM reballing for compatible Samsung Exynos boards Specifications: Model U-SMG3, 0.12 mm thickness, stainless steel stencil. Note: Confirm the IC marking and stencil pattern before use. Individual PA and power IC patterns are not specified in the verified compatibility list...

AMAOE U-SMG4 Samsung Exynos CPU & RAM BGA Reballing Stencil The AMAOE U-SMG4 is a multi-pattern BGA reballing stencil designed for Samsung Exynos motherboard repair. It helps technicians restore solder ball patterns on compatible CPUs, RAM and supporting ICs during chip-level repairs. Supported IC Models CPU: Exynos 880, Exynos 980, Exynos 1080, Exynos 1280, E8825 RAM: RAM556, E8825 RAM Related ICs: SPU13P, SPU14P, 77098B, 77040, 77032, QPA5580, QPA4580, QFM3576, SM5714, SHANNON5511, SHANNON5510, S6565, 78201, 8267-11, 58083-11, S2MU106X01, S3700, BGA153, BGA254 Specifications: Model U-SMG4, 0.12 mm thickness, reusable stainless steel stencil. Note: Verify the IC marking and matching stencil pattern before use...

AMAOE U-SMG5 Samsung Exynos CPU & Power IC BGA Reballing Stencil The AMAOE U-SMG5 is a multi-pattern BGA reballing stencil designed for Samsung Exynos motherboard repair. It supports selected Exynos processors and related power, RAM and RF IC layouts for chip-level servicing. Supported IC Models CPU: Exynos 990, Exynos 2100, Exynos 2200, E9925 Power ICs: MAX77705C/F, SMR526, S5200A, S5311, SPS25, SPS26, SM3080 RAM and related ICs: RAM496, BGA153, W9020 Other ICs: SHANNON-A5123, SHANNON5510, QPM5825, 78217, 78105, 77098, 58083-11, TN2145, KM049, A9140 Specifications: Model U-SMG5, 0.12 mm thickness, stainless steel stencil. Note: Verify the chip marking and matching stencil pattern before use...